Conex Bänninger Triflow: Reliability Guaranteed!
Northern Europe

Conex Bänninger Triflow: Reliability Guaranteed!

17 March 2014

Conex Bänninger is committed to the reliability of the Triflow system with a 25 year product guarantee. Over the years, installers have trusted and relied upon Conex Bänninger Triflow Solder Ring fittings for a hassle-free, leak-free soldered connection on copper tubes.

Conex Bänninger Triflow Solder Ring has the accurate quantity of lead-free solder integrated into each fitting. When heat is applied the solder fills the gap between the tube and fitting by capillary action to form a mechanically strong, leak-proof joint without the need for external solder application.  This certainty takes the guess work out of achieving tight, effective soldered end feed joints and is the reason why millions of the fittings have been sold since they were developed in the early 1970s.

Conex Bänninger Triflow fittings are available in sizes 6 – 67mm and are suitable for connecting copper tubes in accordance with EN 1057 and other standards including ISO 274. Imperial copper tube to BS 659 in sizes 3/8”, 1/2”, 2” and 21/2” can easily be joined by using 12mm, 15mm, 54mm and 67mm fittings as appropriate.  There is a comprehensive range of straight connectors, bends, elbows and tees to suit any application.

Manufactured at the company’s European based factories in accordance to EN 1254-1 and 4, assuring fittings quality from the start.  Over the years the Triflow design has been refined, enhanced and fine-tuned making them the reliable choice for professional installers.  Triflow Solder Rings are manufactured from high-grade copper, gunmetal or dezincification resistant (DZR) brass to counteract dezincification.

All Conex Bänninger Triflow products meet the most stringent conditions imposed by the water regulations against the effect of materials on drinking water quality as lead-free solder is used. Only lead-free solder complying with EN 29453 and ISO 9453 (S-Sn99Cu1 Tin-Copper) is used in the construction of the joint which is applied to the solder bead.

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